Mechanic UV11 Lead-Free Solder Flux Paste – High-Activity Syringe BGA Flux for Phone & PCB Repair

Overview 

The Mechanic UV11 is a high-performance lead-free solder flux paste packaged in a precision syringe dispenser. Specially developed for high-density micro-soldering, surface-mount technology (SMT), and advanced BGA chip reballing, it provides exceptional thermal conductivity and fast wetting action. Its high-purity, eco-friendly lead-free composition ensures zero degradation or risk of short circuits across fine-pitch SMD components and modern smartphone motherboards.

Key Features 

  • Eco-Friendly Lead-Free Formulation: Complies with environmental lead-free standards while delivering powerful oxide-clearing capability during high-heat soldering.

  • Precision Syringe Dispenser: Syringe packaging enables exact, direct application onto tiny solder pads and fine-pitch IC pins without mess or waste.

  • High-Insulation No-Clean Residue: Leaves a clear, non-conductive, non-corrosive residue post-reflow that eliminates post-soldering board leakage.

  • Superior Wetting & Thermal Transfer: Enhances solder flow instantly to eliminate cold joints, bridging, and solder balling on BGA chips.

  • Low Fume & Non-Irritating: Refined chemical matrix minimizes smoke and harsh chemical odors during hot-air rework.

Technical Specifications 

FeatureSpecification
Brand / ModelMechanic / UV11
Flux TypeLead-Free No-Clean Solder Paste
PackagingDispensing Syringe
Color / StateHigh-Clarity Gel Paste
Corrosion LevelNon-Corrosive / Lead-Free
ResidueHigh Insulation, Transparent, No-Clean
ApplicationBGA Chip Reballing, Micro-Soldering, Under-Chip Reflow, FPC Connectors

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