Mechanic SD360 High-Transparency Solder Flux Paste – No-Clean BGA Syringe Flux for Phone & PCB Repair

Overview 

The Mechanic D360 is a premium, high-transparency no-clean flux paste packaged in a convenient syringe dispenser. Specially engineered for high-precision micro-soldering, delicate BGA reballing, and SMT rework, this transparent flux allows technicians a crystal-clear view of solder pads and chip alignment during heating. Its advanced non-corrosive, halogen-free formulation prevents bridge formation and eliminates parasitic electrical leakage across high-density logic boards.

Key Features 

• Crystal-Clear Transparency: High-clarity gel formulation allows complete visual control of IC pad alignment and solder wetting under a microscope during hot-air rework.

• 100% Halogen-Free & Non-Corrosive: Prevents chemical etching and long-term track degradation on sensitive motherboard traces and micro-components.

• Precision Syringe Dispenser: Packaged for clean, effortless application directly onto BGA pads, FPC connectors, or under chips without wasting flux.

• High-Insulation No-Clean Residue: Dries into a non-tacky, highly insulating, non-conductive film post-reflow that does not require mandatory washing.

• Minimal Fumes & Low Splatter: Formulated to reduce smoke and prevents solder ball splattering under hot-air heating, ensuring clean, spherical BGA joint formation.

Technical Specifications 

Common Applications 

• iPhone and Android BGA IC reballing (Power Management IC, Audio Codec, Baseband, Wi-Fi)

• Microscope-assisted drag-soldering of fine-pitch SMD ICs and connector pins

• Precision jumper wire installation and FPC flex cable repairs

• Laptop, tablet, and gaming console motherboard rework