Mechanic Q60 Powerful Antioxidant Flux Paste (60g) – Heavy-Oxide Removal Soldering Flux Jar for BGA & PCB Repair

₨ 340 INC Vat

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SKU: FLX-MC-Q60-60G Category: Tag: Brand:

Overview 

The Mechanic Q60 is a specialized, ultra-high-activity antioxidant soldering flux paste formulated to target heavily oxidized copper pads, aged PCB traces, and difficult-to-solder metal contacts. Packaged in a generous 60g benchtop tub, the Q60 rapidly breaks down tough surface oxides and prevents re-oxidation during high-heat soldering cycles. It is an indispensable tool for liquid-damaged logic board recovery, battery nickel sheet joining, and stubborn BGA pad restoration.

Key Features 

  • Powerful De-Oxidizing Action: Designed with aggressive oxide-clearing activators that dissolve heavy corrosion and rust films on aged copper pads and metal contacts.

  • High Thermal Stability: Resists high heat under hot-air guns and soldering iron tips without drying out prematurely, drying black, or burning off.

  • No-Clean Formula: Dries into a non-corrosive, high-insulation residue that prevents post-solder current leakage across adjacent micro-components.

  • Versatile Metal Bonding: Highly effective for soldering difficult surfaces including nickel battery tabs, stainless steel sheets, and oxidized copper jumper wires.

  • Gel Paste Viscosity: Stays localized right where applied without excessive running or slumping across dense motherboard sections.

Technical Specifications 

FeatureSpecification
Brand / ModelMechanic / Q60
Flux TypePowerful Antioxidant / De-Oxidizing Flux Paste
Packaging60g Benchtop Jar
Color / StateHigh-Viscosity Gel Paste
Corrosion LevelNon-Corrosive Post-Reflow / High-Activity
ResidueNon-Conductive, No-Clean
ApplicationHeavy Pad De-Oxidizing, Water-Damaged Board Repair, Battery Nickel Soldering

Common Applications 

  • Restoring black/oxidized copper pads on water-damaged smartphone motherboards

  • Soldering nickel tabs onto 18650/Li-ion battery cells

  • Pre-tinning severely tarnished jumper wires and copper braiding

  • BGA reballing and IC replacement on aged laptop and automotive PCBs

Weight2000 g
Dimensions15 × 10 × 10 cm

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