
Mechanic SU7 Green High-Viscosity UV Curing Solder Mask Ink (10cc Syringe) – Rapid Hardening PCB Insulating Oil for Phone Repair
₨ 210 INC Vat
- Cash on Delivery all over Pakistan
- Fast delivery by TCS, or pick up from Hall Road, Lahore
- Tested & genuine, checked before dispatch
- Easy returns - see our policy
Overview
The Mechanic SU7 Green is a high-viscosity, light-curing UV solder mask gel engineered specifically for micro-soldering, flying jumper wire anchors, and multi-layer logic board trace repairs. Unlike thin liquid solder mask inks that flow unpredictably across surrounding component pads, the SU7 thixotropic gel stays exactly where placed. Upon exposure to ultraviolet light, it cures within seconds into a tough, heat-resistant, and high-dielectric green polymer shield that restores the original protective coating on smartphone, tablet, and laptop PCBs.
Key Features
High-Viscosity Gel Formula: Prevents slumping or accidental spreading onto adjacent BGA pads, enabling precise micro-dot placement under microscopic magnification.
Rapid Multi-Layer UV Curing: Hardens rapidly in 3 to 10 seconds under a high-power 395nm UV light source without leaving a tacky or wet sub-surface layer.
Classic PCB Green Finish: Matches standard motherboard substrate colors for clean, professional, and visually clear trace line restoration.
High Dielectric Insulation: Offers robust electrical protection against high-voltage leakage, parasitic interference, and short circuits across ultra-fine traces.
High Heat & Reflow Tolerance: Resists thermal degradation, melting, or lifting during subsequent hot-air rework and soldering iron contact.
Technical Specifications
| Feature | Specification |
| Brand / Model | Mechanic / SU7 |
| Product Type | High-Viscosity Light-Curing UV Masking Gel |
| Color | Standard PCB Green / Gloss Finish |
| Packaging | 10cc Precision Dispensing Syringe |
| Viscosity Class | Thixotropic Gel / High Viscosity |
| Curing Speed | 3 – 10 seconds (with High-Power 395nm UV Lamp) |
| Application | Flying Jumper Wire Anchor, BGA Pad Isolation, Trace Masking, Substrate Reconstruction |
Common Applications
Anchoring 0.01mm and 0.02mm ultra-fine enameled copper jumper wires on mobile motherboards
Rebuilding missing BGA pads and insulating jump channels underneath IC chips
Repairing scratched or scraped solder mask layers after copper trace restoration
Isolating exposed ground planes and preventing solder bridging during component reflow
| Weight | 1450 g |
|---|---|
| Dimensions | 15 × 10 × 10 cm |




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