Mechanic SU7 Green High-Viscosity UV Curing Solder Mask Ink (10cc Syringe) – Rapid Hardening PCB Insulating Oil for Phone Repair

₨ 210 INC Vat

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SKU: ACC-MC-SU7-GRN-10CC Category: Tag: Brand:

Overview 

The Mechanic SU7 Green is a high-viscosity, light-curing UV solder mask gel engineered specifically for micro-soldering, flying jumper wire anchors, and multi-layer logic board trace repairs. Unlike thin liquid solder mask inks that flow unpredictably across surrounding component pads, the SU7 thixotropic gel stays exactly where placed. Upon exposure to ultraviolet light, it cures within seconds into a tough, heat-resistant, and high-dielectric green polymer shield that restores the original protective coating on smartphone, tablet, and laptop PCBs.

Key Features 

  • High-Viscosity Gel Formula: Prevents slumping or accidental spreading onto adjacent BGA pads, enabling precise micro-dot placement under microscopic magnification.

  • Rapid Multi-Layer UV Curing: Hardens rapidly in 3 to 10 seconds under a high-power 395nm UV light source without leaving a tacky or wet sub-surface layer.

  • Classic PCB Green Finish: Matches standard motherboard substrate colors for clean, professional, and visually clear trace line restoration.

  • High Dielectric Insulation: Offers robust electrical protection against high-voltage leakage, parasitic interference, and short circuits across ultra-fine traces.

  • High Heat & Reflow Tolerance: Resists thermal degradation, melting, or lifting during subsequent hot-air rework and soldering iron contact.

Technical Specifications 

FeatureSpecification
Brand / ModelMechanic / SU7
Product TypeHigh-Viscosity Light-Curing UV Masking Gel
ColorStandard PCB Green / Gloss Finish
Packaging10cc Precision Dispensing Syringe
Viscosity ClassThixotropic Gel / High Viscosity
Curing Speed3 – 10 seconds (with High-Power 395nm UV Lamp)
ApplicationFlying Jumper Wire Anchor, BGA Pad Isolation, Trace Masking, Substrate Reconstruction

Common Applications 

  • Anchoring 0.01mm and 0.02mm ultra-fine enameled copper jumper wires on mobile motherboards

  • Rebuilding missing BGA pads and insulating jump channels underneath IC chips

  • Repairing scratched or scraped solder mask layers after copper trace restoration

  • Isolating exposed ground planes and preventing solder bridging during component reflow

Weight1450 g
Dimensions15 × 10 × 10 cm

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