Mechanic XG30 Special Solder Paste (30g) – Sn63/Pb37 183°C High-Purity BGA Solder Flux Paste for Phone Repair

Overview

The Mechanic XG30 Special (often designated as XG-30 / XG-Z40 variants) is a high-grade Sn63/Pb37 leaded solder paste formulated for micro-soldering, PCB rework, and BGA reballing on delicate electronics. Packaged in a compact 30-gram jar, this solder paste offers exceptional wetting capability, consistent particle sizing, and low residue. It flows effortlessly under hot air to create bright, durable solder joints with zero cold-solder bridges.

Key Features

• Ideal Melting Point (183°C): Standard eutectic Sn63/Pb37 alloy melts fast at 183°C, reducing thermal exposure to sensitive micro-chips and surrounding PCB components.

• Fine Particle Distribution: Uniform Type 3 / Type 4 powder sizing ensures smooth dispensing through fine-pitch reballing stencils without clogging or slumping.

• High-Purity Flux Matrix: Built-in high-activity flux breaks through surface oxidation during reflow and leaves a minimal, non-corrosive residue.

• Strong Tackiness: Superior initial viscosity keeps tiny SMD components and solder balls securely in place before heat application.

• 30-Gram Practical Jar: Convenient size that is easy to handle and ideal for preventing waste from long-term open exposure.

Technical Specifications 

Common Applications 

• iPhone & Android BGA IC reballing (Power IC, Audio IC, Baseband, CPU/RAM stacks)

• Micro-soldering SMD components (0201/0402 passives, connectors, filters)

• Repairing torn pads and trace jumper points on mobile phone motherboards

• General precision PCB repairs in electronics workshops