Mechanic LW50 Low-Temp Solder Paste (50g) – Sn42/Bi58 138°C Lead-Free BGA Solder Paste for Phone Repair

Overview 

The Mechanic LW50 is a specialized, low-temperature lead-free (Sn42/Bi58) solder paste formulated for delicate micro-soldering, heat-sensitive BGA IC reballing, and multi-layer PCB repairs. Melting at just 138°C, the LW50 allows technicians to solder components with minimal thermal exposure, drastically reducing the risk of board warping, blistering, or heat damage to adjacent delicate chips (such as CPUs, RAM, and display ICs).

Key Features 

• Low-Temperature Melting (138°C): Eutectic Tin-Bismuth (Sn42/Bi58) alloy melts at a significantly lower temperature than standard leaded (183°C) or lead-free (217°C) pastes.

• Thermal Protection: Ideal for heat-sensitive components, flexible PCBs (FPCs), face ID sensors, and delicate camera module connectors that cannot tolerate high heat.

• Type 4 Fine Powder Formulation: Uniform 20–38 µm particle size delivers smooth dispensing and clean stencil separation without bridging.

• Non-Corrosive Flux Matrix: High-activity, no-clean flux ensures strong wetting on copper pads and chip contacts, leaving behind minimal non-conductive residue.

• Generous 50-Gram Jar: Provides exceptional value and plenty of material for busy repair bench workflows.

Technical Specifications ⚙️

Common Applications 

• iPhone & Android heat-sensitive BGA IC reballing (WiFi ICs, Audio Codecs, CPU/RAM top layers)

• Soldering plastic FPC connectors on screen/battery flex cables

• Double-decker motherboard separation/pre-tinning rework

• LED, OLED, and flexible circuit micro-soldering