Mechanic SU7 Blue High-Viscosity UV Curing Solder Mask Ink (10cc Syringe) – Rapid Hardening PCB Insulating Oil for Phone Repair

₨ 210 INC Vat

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SKU: ACC-MC-SU7-BLU-10CC Category: Tag: Brand:

Overview 

The Mechanic SU7 Blue is a premium, high-viscosity light-curing UV solder mask gel engineered specifically for micro-soldering, flying jumper wire fixation, and precision PCB trace restoration. Unlike thin liquid solder mask inks that spill across adjacent components, the SU7 thixotropic gel stays exactly where placed under a microscope. Its distinct, high-contrast blue color provides maximum visual clarity, allowing technicians to easily track custom wire paths, verify pad isolation, and lock micro-jumper connections in place under ultraviolet light.

Key Features 

  • High-Viscosity Gel Formula: Holds its shape without slumping, running, or bleeding onto neighboring IC pads, enabling pinpoint micro-dot placement.

  • Rapid Multi-Layer UV Curing: Hardens in 3 to 10 seconds under a high-power 395nm UV lamp, creating a rock-hard dielectric barrier without a sticky sub-surface layer.

  • High-Contrast Blue Finish: Bright blue pigment makes custom jumper wiring and repaired board sections instantly visible and traceable under microscope optics.

  • Superior High-Voltage Insulation: Protects fragile micro-traces from high-voltage leakage, parasitic interference, and short circuits across high-density logic boards.

  • High Heat & Reflow Resistance: Withstands high temperatures from hot-air rework stations and soldering iron tips without peeling, cracking, or lifting.

Technical Specifications 

FeatureSpecification
Brand / ModelMechanic / SU7
Product TypeHigh-Viscosity Light-Curing UV Masking Gel
ColorHigh-Contrast Gloss Blue
Packaging10cc Precision Dispensing Syringe
Viscosity ClassThixotropic Gel / High Viscosity
Curing Speed3 – 10 seconds (with High-Power 395nm UV Lamp)
ApplicationFlying Jumper Wire Anchor, BGA Pad Isolation, Trace Masking, Substrate Reconstruction

Common Applications 

  • Anchoring 0.01mm and 0.02mm ultra-fine enameled copper jumper wires on mobile motherboards

  • Isolating custom wire runs from ground planes and nearby BGA chip pads

  • Rebuilding broken or missing BGA pads and insulating underneath IC chips

  • Color-coding specialized or custom logic board wire jumps during complex repairs

Weight1450 g
Dimensions15 × 10 × 10 cm

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