
Mechanic SU7 Blue High-Viscosity UV Curing Solder Mask Ink (10cc Syringe) – Rapid Hardening PCB Insulating Oil for Phone Repair
₨ 210 INC Vat
- Cash on Delivery all over Pakistan
- Fast delivery by TCS, or pick up from Hall Road, Lahore
- Tested & genuine, checked before dispatch
- Easy returns - see our policy
Overview
The Mechanic SU7 Blue is a premium, high-viscosity light-curing UV solder mask gel engineered specifically for micro-soldering, flying jumper wire fixation, and precision PCB trace restoration. Unlike thin liquid solder mask inks that spill across adjacent components, the SU7 thixotropic gel stays exactly where placed under a microscope. Its distinct, high-contrast blue color provides maximum visual clarity, allowing technicians to easily track custom wire paths, verify pad isolation, and lock micro-jumper connections in place under ultraviolet light.
Key Features
High-Viscosity Gel Formula: Holds its shape without slumping, running, or bleeding onto neighboring IC pads, enabling pinpoint micro-dot placement.
Rapid Multi-Layer UV Curing: Hardens in 3 to 10 seconds under a high-power 395nm UV lamp, creating a rock-hard dielectric barrier without a sticky sub-surface layer.
High-Contrast Blue Finish: Bright blue pigment makes custom jumper wiring and repaired board sections instantly visible and traceable under microscope optics.
Superior High-Voltage Insulation: Protects fragile micro-traces from high-voltage leakage, parasitic interference, and short circuits across high-density logic boards.
High Heat & Reflow Resistance: Withstands high temperatures from hot-air rework stations and soldering iron tips without peeling, cracking, or lifting.
Technical Specifications
| Feature | Specification |
| Brand / Model | Mechanic / SU7 |
| Product Type | High-Viscosity Light-Curing UV Masking Gel |
| Color | High-Contrast Gloss Blue |
| Packaging | 10cc Precision Dispensing Syringe |
| Viscosity Class | Thixotropic Gel / High Viscosity |
| Curing Speed | 3 – 10 seconds (with High-Power 395nm UV Lamp) |
| Application | Flying Jumper Wire Anchor, BGA Pad Isolation, Trace Masking, Substrate Reconstruction |
Common Applications
Anchoring 0.01mm and 0.02mm ultra-fine enameled copper jumper wires on mobile motherboards
Isolating custom wire runs from ground planes and nearby BGA chip pads
Rebuilding broken or missing BGA pads and insulating underneath IC chips
Color-coding specialized or custom logic board wire jumps during complex repairs
| Weight | 1450 g |
|---|---|
| Dimensions | 15 × 10 × 10 cm |




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