
Mechanic UV80 Halogen-Free Solder Flux Paste (210g) – High-Activity BGA Soldering Flux Jar for Phone & PCB Repair
₨ 620 INC Vat
- Cash on Delivery all over Pakistan
- Fast delivery by TCS, or pick up from Hall Road, Lahore
- Tested & genuine, checked before dispatch
- Easy returns - see our policy
Overview
The Mechanic UV80 is a high-grade, halogen-free rosin soldering flux paste packaged in a heavy-duty 210g workshop jar. Engineered specifically for high-volume micro-soldering, SMT assembly, and BGA IC reballing, this flux features rapid wetting action and powerful oxide breakdown. Its zero-halogen composition ensures zero risk of chemical corrosion or electrical leakage across dense logic boards, making it the ultimate economical choice for commercial repair centers.
Key Features
100% Halogen-Free Safety: Formulated without corrosive chlorine or bromine compounds to protect delicate copper traces and chip pads against long-term degradation.
Bulk 210g Workshop Size: Generous volume designed for daily commercial bench use, providing exceptional value for professional repair technicians.
High Insulation & No-Clean: Leaves a clear, non-conductive, non-tacky film post-reflow that eliminates parasitic current leakage without requiring mandatory washing.
Superior Wetting & Heat Transfer: Facilitates fast, uniform heat transfer and smooth solder flow, eliminating cold solder joints and pad bridging.
Low Smoke & Non-Irritating: Refined rosin matrix minimizes fumes and harsh chemical odors during prolonged hot-air heating.
Technical Specifications
| Feature | Specification |
| Brand / Model | Mechanic / UV80 |
| Flux Type | Halogen-Free Rosin Flux Paste |
| Packaging | 210g Workshop Jar |
| Color / State | High-Clarity Light Amber Paste |
| Corrosion Level | Non-Corrosive / Zero Halogen |
| Residue | High Insulation, Transparent, No-Clean |
| Application | BGA Reballing, Micro-Soldering, Pad De-Oxidizing, Wire Pre-Tinning |
Common Applications
Smartphone motherboard BGA IC reballing (Power IC, Audio Codec, Baseband)
High-volume PCB assembly and SMT rework
De-oxidizing and pre-tinning copper pads with solder wick during cleanup
Laptop, tablet, TV, and gaming console motherboard repairs
| Weight | 1450 g |
|---|---|
| Dimensions | 22 × 16 × 10 cm |




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