Mechanic UV80 Halogen-Free Solder Flux Paste (210g) – High-Activity BGA Soldering Flux Jar for Phone & PCB Repair

₨ 620 INC Vat

Order on WhatsApp
  • Cash on Delivery all over Pakistan
  • Fast delivery by TCS, or pick up from Hall Road, Lahore
  • Tested & genuine, checked before dispatch
  • Easy returns - see our policy
SKU: FLX-MC-UV80-210G Category: Tag: Brand:

Overview 

The Mechanic UV80 is a high-grade, halogen-free rosin soldering flux paste packaged in a heavy-duty 210g workshop jar. Engineered specifically for high-volume micro-soldering, SMT assembly, and BGA IC reballing, this flux features rapid wetting action and powerful oxide breakdown. Its zero-halogen composition ensures zero risk of chemical corrosion or electrical leakage across dense logic boards, making it the ultimate economical choice for commercial repair centers.

Key Features 

  • 100% Halogen-Free Safety: Formulated without corrosive chlorine or bromine compounds to protect delicate copper traces and chip pads against long-term degradation.

  • Bulk 210g Workshop Size: Generous volume designed for daily commercial bench use, providing exceptional value for professional repair technicians.

  • High Insulation & No-Clean: Leaves a clear, non-conductive, non-tacky film post-reflow that eliminates parasitic current leakage without requiring mandatory washing.

  • Superior Wetting & Heat Transfer: Facilitates fast, uniform heat transfer and smooth solder flow, eliminating cold solder joints and pad bridging.

  • Low Smoke & Non-Irritating: Refined rosin matrix minimizes fumes and harsh chemical odors during prolonged hot-air heating.

Technical Specifications 

FeatureSpecification
Brand / ModelMechanic / UV80
Flux TypeHalogen-Free Rosin Flux Paste
Packaging210g Workshop Jar
Color / StateHigh-Clarity Light Amber Paste
Corrosion LevelNon-Corrosive / Zero Halogen
ResidueHigh Insulation, Transparent, No-Clean
ApplicationBGA Reballing, Micro-Soldering, Pad De-Oxidizing, Wire Pre-Tinning

Common Applications

  • Smartphone motherboard BGA IC reballing (Power IC, Audio Codec, Baseband)

  • High-volume PCB assembly and SMT rework

  • De-oxidizing and pre-tinning copper pads with solder wick during cleanup

  • Laptop, tablet, TV, and gaming console motherboard repairs

Weight1450 g
Dimensions22 × 16 × 10 cm

Reviews

There are no reviews yet.

Be the first to review “Mechanic UV80 Halogen-Free Solder Flux Paste (210g) – High-Activity BGA Soldering Flux Jar for Phone & PCB Repair”

Your email address will not be published. Required fields are marked *