MC Constant Temperature Desoldering Station – PTC Heating Plate for LED & BGA PCB Rework

₨ 269,000

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SKU: TOOL-DESOLD-MC-PTC Category: Brand:

Overview 

The MC Constant Temperature Desoldering Station is an essential high-efficiency heating plate designed for rapid PCB preheating, BGA chip reballing, and SMD/LED component desoldering. Powered by self-regulating Positive Temperature Coefficient (PTC) heating element technology and an integrated high-conductivity aluminum alloy plate, it achieves quick thermal warmup to a stable, automatic temperature threshold without requiring complex external digital temperature controllers.

Key Features 

  • PTC Automatic Constant Temperature: Self-regulating ceramic heating element automatically stabilizes at optimum reflow/desoldering temperatures (260Β°C Β± 10%).

  • Rapid Thermal Ramp-Up: High-efficiency thermal transfer reaches operating temperature in seconds, speeding up repetitive LED strip and PCB repair tasks.

  • Heavy-Duty Aluminum Plate: Precision-machined flat aluminum alloy surface ensures even heat distribution across the entire workspace area to prevent localized thermal warping.

  • Compact & Low-Profile: Highly portable, space-saving design suitable for small electronics repair benches and field toolkits.

  • Versatile Rework Utility: Ideal for desoldering aluminum baseplate LED lamp beads, CPU/GPU BGA chips, SMD power inductors, and terminal blocks.

Technical Specifications 

FeatureSpecification
Operating Voltage220V AC / 50Hz
Max Power Output300W – 400W (Instantaneous peak), ~30W (Constant phase)
Constant Temperatureβ‰ˆ 260Β°C Β± 10%
Heating MaterialCeramic PTC Heating Element
Plate MaterialAviation Grade Conductive Aluminum Alloy
Warm-Up TimeApprox. 30 seconds to reach operating temperature

Ideal Applications 

  • LED Bulb & TV Backlight Repair: Rapid replacement of burnt-out SMD 2835, 3030, or 5730 LED chips on metal-core PCBs without damaging the circuit traces.

  • BGA & SMD Preheating: Preheating multi-layer motherboard boards to reduce thermal stress prior to hot air gun soldering or IC removal.

  • Lab & Prototyping: Reflow soldering small surface-mount prototype boards treated with solder paste.

Weight2000 g
Dimensions22 × 16 × 10 cm

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