
MC Constant Temperature Desoldering Station β PTC Heating Plate for LED & BGA PCB Rework
₨ 269,000
- Cash on Delivery all over Pakistan
- Fast delivery by TCS, or pick up from Hall Road, Lahore
- Tested & genuine, checked before dispatch
- Easy returns - see our policy
Overview
The MC Constant Temperature Desoldering Station is an essential high-efficiency heating plate designed for rapid PCB preheating, BGA chip reballing, and SMD/LED component desoldering. Powered by self-regulating Positive Temperature Coefficient (PTC) heating element technology and an integrated high-conductivity aluminum alloy plate, it achieves quick thermal warmup to a stable, automatic temperature threshold without requiring complex external digital temperature controllers.
Key Features
PTC Automatic Constant Temperature: Self-regulating ceramic heating element automatically stabilizes at optimum reflow/desoldering temperatures (260Β°C Β± 10%).
Rapid Thermal Ramp-Up: High-efficiency thermal transfer reaches operating temperature in seconds, speeding up repetitive LED strip and PCB repair tasks.
Heavy-Duty Aluminum Plate: Precision-machined flat aluminum alloy surface ensures even heat distribution across the entire workspace area to prevent localized thermal warping.
Compact & Low-Profile: Highly portable, space-saving design suitable for small electronics repair benches and field toolkits.
Versatile Rework Utility: Ideal for desoldering aluminum baseplate LED lamp beads, CPU/GPU BGA chips, SMD power inductors, and terminal blocks.
Technical Specifications
| Feature | Specification |
| Operating Voltage | 220V AC / 50Hz |
| Max Power Output | 300W β 400W (Instantaneous peak), ~30W (Constant phase) |
| Constant Temperature | β 260Β°C Β± 10% |
| Heating Material | Ceramic PTC Heating Element |
| Plate Material | Aviation Grade Conductive Aluminum Alloy |
| Warm-Up Time | Approx. 30 seconds to reach operating temperature |
Ideal Applications
LED Bulb & TV Backlight Repair: Rapid replacement of burnt-out SMD 2835, 3030, or 5730 LED chips on metal-core PCBs without damaging the circuit traces.
BGA & SMD Preheating: Preheating multi-layer motherboard boards to reduce thermal stress prior to hot air gun soldering or IC removal.
Lab & Prototyping: Reflow soldering small surface-mount prototype boards treated with solder paste.
| Weight | 2000 g |
|---|---|
| Dimensions | 22 × 16 × 10 cm |
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