Mechanic IX5 Ultra Universal Preheating Platform – PCB Heating & Desoldering Station in Pakistan

Overview 

The Mechanic IX5 Ultra (iX5 Ultra Breakthrough) is a compact heating workstation designed for delicate mobile phone repair. Built with a high-grade aluminum alloy heating panel, it delivers consistent, windless bottom heat across its surface, allowing technicians to desolder chips, remove underfill glue, and separate middle-layer (sandwich) boards without blowing surrounding micro-components away with hot air. It is a must-have tool for repairing iPhone (X through 15 series) and Android logic boards, face-ID dot matrix modules, and IC reballing setups.

Key Features 

• Air-Gun & Iron-Free Heating: Delivers uniform thermal energy across the plate, eliminating heat gun airflow that risks blowing away tiny SMD passives.

• Wide Temperature Control: Precision adjustable digital temperature control suited for underfill glue softening, tin planting, and board lamination/delamination.

• Universal Motherboard Compatibility: Designed to securely hold and heat all sizes of mobile phone motherboards, including double-decker sandwich PCBs.

• Durable Aluminum Alloy Surface: Ensures high thermal conductivity, fast heat-up times, and flat clamping stability.

• Compact Bench Footprint: Ultra-small 80 × 80 mm layout frees up space on busy repair workbenches.

Technical Specifications