The Mechanic Desoldering Wire R300 is a professional-grade desoldering wick designed for high-precision electronics repair. Whether you are cleaning BGA pads on a smartphone motherboard or removing a bridge on an Arduino project, the R300’s 2.5mm width provides the perfect balance of suction and surface area. Made from ultra-fine, geometrically braided copper, it acts like a magnet for molten solder, leaving your pads clean and ready for a fresh component.
Key Features of the Mechanic R300
High-Purity Copper: The Mechanic Desoldering Wire R300 is made of oxygen-free copper with a high-density braid for maximum capillary action.
Non-Clean Flux Coating: Pre-saturated with a specialized flux that improves solder absorption without leaving a sticky or corrosive residue.
Thermal Efficiency: Quickly transfers heat to the solder, reducing the risk of overheating sensitive components or lifting PCB pads.
Standard 2.5mm Width: The “Goldilocks” size—wide enough for large pads but precise enough for SMD work.
Technical Specifications
Feature
Specification
Model
Mechanic R300
Material
High-Density Braided Copper
Flux Type
Non-Clean / Anti-Oxidation
Wire Width
2.5 mm
Total Length
1.5 Meters
Application
BGA, SMD, DIP, Mobile, and Laptop Repair
Weight
2000 g
Dimensions
15 × 10 × 5 cm
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