
Mechanic UV Mute Green Solder Mask Ink (10cc Syringe) – Insulating PCB Protection & Jump Wire Curing Oil for Mobile Repair
₨ 190 INC Vat
- Cash on Delivery all over Pakistan
- Fast delivery by TCS, or pick up from Hall Road, Lahore
- Tested & genuine, checked before dispatch
- Easy returns - see our policy
Overview
The Mechanic Green UV Solder Mask Ink is an essential light-curing insulating liquid designed for micro-soldering, PCB trace restoration, and flying jumper wire insulation. Packaged in a 10cc syringe dispenser, this solder mask cures within seconds when exposed to ultraviolet (UV) light, forming a tough, heat-resistant, and non-conductive dielectric barrier. It protects exposed copper, prevents solder bridging on exposed traces, and locks fragile jumper wires permanently in place during smartphone and laptop motherboard repairs.
Key Features
Rapid UV Light Curing: Solidifies in 5 to 10 seconds under a high-power UV curing lamp, providing an instant protective shield.
Superior High-Voltage Insulation: Formulated to resist electrical breakdown, current leakage, and shorting between closely spaced micro-traces.
High Thermal & Chemical Resistance: Resists melting or degrading during subsequent hot-air or soldering iron rework cycles.
Precision Syringe Dispensing: Enables micro-drop application on target pads, jumper wires, or scratched PCB mask areas without mess.
Strong Substrate Adhesion: Bonds tightly to FR-4 PCB substrates, copper traces, and glass surfaces.
Technical Specifications
| Feature | Specification |
| Brand / Model | Mechanic / UV Green Mask |
| Product Type | Ultraviolet Light Curing Solder Mask Ink |
| Color | Mute Green / Gloss Green |
| Packaging | 10cc Dispensing Syringe |
| Viscosity | 25°C 200 ± 50ps |
| Curing Speed | 5 – 15 seconds (with 365nm / 395nm UV Lamp) |
| Application | PCB Trace Repair, Jumper Wire Insulation, BGA Pad Isolation |
Common Applications
Insulating flying jumper wires across logic board traces (iPhone & Android repair)
Covering exposed copper pads and scratched PCB traces to prevent bridging
Isolating BGA chip pads after pad recovery or wire jump restoration
Repairing damaged solder mask layers on laptop, tablet, and gaming console motherboards
| Weight | 2000 g |
|---|---|
| Dimensions | 15 × 10 × 10 cm |




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