Mechanic XG50 Special Solder Paste 35g – Sn63/Pb37 183°C BGA Reballing Paste in Pakistan

Overview 📝

The Mechanic XG50 is one of the most widely trusted solder paste formulations among micro-soldering technicians and mobile repair specialists across Pakistan. Formulated with a eutectic  alloy and fine Type 3 powder , it melts cleanly at 183°C. Its non-drying rosin flux core delivers exceptional wetting properties, preventing pad oxidation and creating strong, highly conductive, mirror-finish solder joints without splatter.

Key Features 

• Eutectic 183°C Melting Point: Sn63/Pb37 alloy transitions instantly from liquid to solid at 183°C, eliminating cold joints and component shift during reflow.

• Uniform Particle Distribution: Particle Size Type 3  prevents stencil clogging and solder bridging on fine-pitch ICs.

• No-Clean Rosin Flux Base: High insulation resistance post-reflow leaves minimal non-corrosive residue, keeping logic boards clean.

• Superior Wetting & Adhesion: Sticks firmly to pads and stencil apertures during scraping, ensuring spherical solder balls during BGA reballing.

• Long Shelf Life: Hermetically sealed jar keeps the paste moist and malleable over months of daily bench use.

Technical Specifications