Seeed Studio XIAO nRF54L15 (Pre-Soldered) – Next-Gen Bluetooth 5.4 & LE Audio MCU (Min Order 5 Pcs) in Pakistan

 4,500 INC Vat

Guaranteed Safe Checkout
Extra Features
  • Premium Quality
  • Secure Payments
  • Satisfaction Guarantee
  • Worldwide Shipping
  • Money Back Guarantee

Overview 

The Seeed Studio XIAO nRF54L15 is a thumb-sized powerhouse featuring the latest Nordic nRF54L15 SoC. It is designed to replace the industry-standard nRF52840, offering twice the processing power and significantly better energy efficiency. With its built-in Bluetooth 5.4 stack, it supports LE Audio and ultra-accurate direction finding. This specific SKU comes with pre-soldered headers, making it perfect for immediate integration into breadboards or carrier boards for professional prototyping.

Key Features 

  • Next-Gen Performance: Powered by an Arm Cortex-M33 running at up to 128MHz—nearly double the speed of the previous generation.

  • Bluetooth 5.4 Ready: Supports the latest wireless standards including LE Audio, Channel Sounding, and 802.15.4 (Thread/Zigbee).

  • Extreme Efficiency: Built on a new process node that reduces power consumption, extending battery life for wearables by months.

  • XIAO Form Factor: Maintains the classic 21 x 17.5mm footprint, compatible with the entire Seeed XIAO ecosystem and expansion boards.

  • Enhanced Security: Features modern hardware security to protect your firmware and user data from sophisticated attacks.

Technical Specifications 

Feature Specification
Microcontroller Nordic nRF54L15 (Arm Cortex-M33)
Clock Speed Up to 128 MHz
Flash / RAM 1.5 MB Flash / 256 KB RAM
Wireless Bluetooth 5.4, Bluetooth Mesh, Thread, Zigbee
Interface 1x UART, 1x I2C, 1x SPI, 11x GPIO, 6x ADC
Battery Support Integrated Battery Charging (USB-C)
Headers Pre-Soldered 2.54mm Pins
Operating Voltage 3.3V Logic

Reviews

There are no reviews yet.

Be the first to review “Seeed Studio XIAO nRF54L15 (Pre-Soldered) – Next-Gen Bluetooth 5.4 & LE Audio MCU (Min Order 5 Pcs) in Pakistan”

Your email address will not be published. Required fields are marked *