AI-Thinker ESP32-S Module – High Performance SMD Wi-Fi + Bluetooth BLE MCU Chip

SKU: MCU-ESP32-S-SMD

 900

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Description

Overview

The AI-Thinker ESP32-S is a highly integrated, ultra-low-power Wi-Fi and Bluetooth combo module designed for surface-mount (SMD) integration. Engineered around the powerful ESP32 chip, it houses a dual-core 32-bit Xtensa LX6 microprocessor operating at up to 240 MHz. This standalone module is the industry choice for advanced engineering students, industrial product developers, and automated hardware designers who are transitioning from a breadboard prototype to a finalized custom PCB layout.

Key Features

  • Industrial SMD Design: Compact stamp-hole pattern layout, perfect for automated pick-and-place assembly or manual precise soldering on custom PCBs.

  • Dual-Core Processing: Massive processing power with independent core management for handling heavy communication protocols and sensor readouts concurrently.

  • Hybrid Wireless Connectivity: Combines high-speed 2.4GHz Wi-Fi (802.11 b/g/n) with Bluetooth v4.2 BR/EDR and BLE for long-range IoT networks.

  • Shielded Reliability: Covered by an official metal casing to prevent electromagnetic interference (EMI) and ensure regulatory compliance in commercial electronics.

Technical Specifications

Feature Specification
Manufacturer AI-Thinker
Processor Xtensa Dual-Core 32-bit LX6 Microprocessor (up to 240MHz)
Flash Memory 4 MB SPI Flash
SRAM 520 KB Internal SRAM
Wireless Protocol Wi-Fi 802.11 b/g/n + Bluetooth 4.2 BR/EDR & BLE
Antenna Type On-board PCB Trace Antenna
Operating Voltage 3.0V to 3.6V DC (Ideal: 3.3V)
Operating Current Average: 80mA
Peripherals UART, SPI, I2C, PWM, I2S, ADC, DAC, Touch Sensors
Dimensions 25.5mm x 18.0mm x 3.1mm

Ideal Applications

  • Custom PCB Manufacturing: The standard module chosen for manufacturing customized home automation, smart agriculture systems, and telemetry devices.

  • Smart Wearables: Extremely low-profile footprint fits inside small enclosures.

  • IP Cameras & Audio Streaming: Capable of high-speed data throughput via integrated Wi-Fi protocols.

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