Mechanic SU7 Black High-Viscosity UV Curing Solder Mask Ink (10cc Syringe) – Rapid Hardening PCB Insulating Oil for Phone Repair

₨ 210

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SKU: ACC-MC-SU7-BLK-10CC Categories: , Brand:

OverviewΒ 

The Mechanic SU7 is a next-generation, high-viscosity black UV curing solder mask ink engineered specifically for high-precision micro-soldering and complex motherboard trace restoration. Unlike standard low-viscosity solder masks that bleed or run across delicate components, the SU7 gel-paste formula stays exactly where you apply it. It cures rapidly under ultraviolet light to form an ultra-tough, high-temperature dielectric barrier. Its deep OEM-black pigment matches modern smartphone PCBs, making it the preferred choice for fixing 0.01mm flying jumper wires, isolating exposed BGA pads, and reinforcing reconstructed board corners.

Key FeaturesΒ 

  • High-Viscosity Gel Formula: Does not run, slump, or spread onto adjacent solder pads, allowing pinpoint micro-dot application under a microscope.

  • Rapid Multi-Layer UV Curing: Formulated with photo-initiators that penetrate deep black pigmentation, hardening completely in 3 to 10 seconds under a 395nm UV lamp without leaving a sticky surface film.

  • High Dielectric Insulation: Provides robust electrical resistance against parasitic capacitance, cross-talk, and high-voltage short circuits on multi-layer smartphone logic boards.

  • High-Temperature Resistance: Withstands hot-air reflow and soldering iron contact up to 300Β°C+ without cracking, peeling, or degrading.

  • OEM-Grade Factory Finish: Blends invisibly with dark iPhone and Android motherboards for a clean, commercial-quality repair result.

Technical SpecificationsΒ 

FeatureSpecification
Brand / ModelMechanic / SU7
Product TypeHigh-Viscosity Light-Curing UV Masking Gel
ColorOEM Deep Matte Black
Packaging10cc Precision Dispensing Syringe
Viscosity ClassThixotropic Gel / High Viscosity
Curing Speed3 – 10 seconds (with High-Power 395nm UV Lamp)
ApplicationFlying Jumper Wire Anchor, BGA Pad Isolation, Trace Masking, Corner Chip Sealing

Common ApplicationsΒ 

  • Anchoring ultra-fine 0.01mm and 0.02mm enameled copper jumper wires on iPhone and Android motherboards

  • Rebuilding missing or broken BGA pads and insulating under-chip trace jump channels

  • Covering exposed copper, scratched ground planes, and repaired traces after pad scraping

  • Shielding light-sensitive IC sensors (Face ID, proximity, ambient light flex cables) from light bleeding

Weight1450 g
Dimensions15 × 10 × 10 cm

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